The compound semiconductor market is set to reach $25 billion by 2030 according to market research firm Yole's latest report, ...
The University of Sheffield's School of Electrical and Electronic Engineering in collaboration with Matrix TSL and ...
Rohm has developed 650V GaN HEMTs in the TOLL (TO-LeadLess) package - a packaging technology increasingly being adopted in ...
STMicroelectronics has announced the DCP3601, a 3.3V-to-36V input, 1A output miniature monolithic buck converter for powering ...
Taiwan Semiconductor— a supplier of discrete power electronics devices, LED drivers, analogue ICs and ESD protection — has ...
Farnell President, Rebeca Obregon, said, “Colin’s knowledge about electrification is vast, and he’s not known for pulling his ...
Clas-SiC, the UK’s only commercial SiC wafer fab, has secured a £12 million investment from Indian chemical firm Archean ...
TI's GaN FET gate drivers offer different space-qualified packaging options for the three voltage levels, including: ...
The TK024N60Z1 has a drain-source on-resistance RDS (ON) of 0.024Ω (max), which is the lowest in the DTMOSVI 600V series. It ...
GaN and SiC company Navitas Semiconductor has announced unaudited financial results for the Q4 and full year ended December ...
Audio equipment maker SounDigital has integrated Infineon CoolGaN transistors into its new 1500 W Class D amplifier, ...
The CEO expects the majority of its sales over the next few years to come from domestic markets, but 30 percent will be ...