Lee attributed SK hynix's leadership in the HBM market to its development of key packaging technologies, including mass reflow-molded underfill (MR-MUF), which was introduced with HBM2E in 2019.
SK Hynix soars to record profits driven by strong demand for its high-bandwidth memory (HBM) products used in AI applications ...
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Top Samsung rival unveils “world’s largest capacity” 16-Layer HBM3e chips — SK hynix promises boosted performance for all“SK hynix is looking at both Advanced MR-MUF and hybrid bonding methods for 16-layer and higher HBM products.” ...
SK hynix to showcase technological capabilities ... This product uses the advanced MR-MUF process to achieve the industry's highest 16-layer configuration while controlling chip warpage and ...
Buoyed by record sales and profits, chipmaker offers rosy outlook as HBM leader SK hynix, the world's second-largest memory ...
SK hynix to showcase technological capabilities ... This product uses the advanced MR-MUF process to achieve the industry's highest 16-layer configuration while controlling chip warpage and maximizing ...
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